SPB17N80C3 coolmos ? power transistor features ? new revolutionary high voltage technology ? extreme dv/dt rated ? high peak current capability ? qualified according to jedec 1) for target applications ? pb-free lead plating; rohs compliant ? ultra low gate charge ? ultra low effective capacitances coolmos tm 800v designed for: ? industrial application with high dc bulk voltage ? switching application (i.e. active clamp forward) maximum ratings, at t j =25 c, unless otherwise specified parameter symbol conditions unit continuous drain current i d t c =25 c a t c =100 c pulsed drain current 2) i d,pulse t c =25 c avalanche energy, single pulse e as i d =3.4 a, v dd =50 v 670 mj avalanche energy, repetitive t ar 2),3) e ar i d =17 a, v dd =50 v avalanche current, repetitive t ar 2),3) i ar a mosfet d v /d t ruggedness d v /d t v ds =0?640 v v/ns gate source voltage v gs static v ac ( f >1 hz) power dissipation p tot t c =25 c w operating and storage temperature t j , t stg c 30 227 -55 ... 150 0.5 17 50 20 value 17 11 51 v ds 800 v r ds(on)max @ t j = 25c 0.29 ? q g,typ 91 nc product summary type package marking SPB17N80C3 pg-to263 17n80c3 pg-to263 rev. 2. 5 page 1 20 11 -0 9 -2 7
SPB17N80C3 maximum ratings, at t j =25 c, unless otherwise specified parameter symbol conditions unit continuous diode forward current i s a diode pulse current 2) i s,pulse 51 reverse diode d v /d t 4) d v /d t 4 v/ns parameter symbol conditions unit min. typ. max. thermal characteristics thermal resistance, junction - case r thjc - - 0.55 k/w r thja smd version, device on pcb, minimal footprint --62 smd version, device on pcb, 6 cm 2 cooling area 4) -35- soldering temperature, reflow soldering t sold msl1; 10s - - 260 c electrical characteristics, at t j =25 c, unless otherwise specified static characteristics drain-source breakdown voltage v (br)dss v gs =0 v, i d =250 a 800 - - v avalanche breakdown voltage v (br)ds v gs =0 v, i d =17 a - 870 - gate threshold voltage v gs(th) v ds = v gs , i d =1.0 ma 2.1 3 3.9 zero gate voltage drain current i dss v ds =800 v, v gs =0 v, t j =25 c - - 25 a v ds =800 v, v gs =0 v, t j =150 c - 150 - gate-source leakage current i gss v gs =20 v, v ds =0 v - - 100 na drain-source on-state resistance r ds(on) v gs =10 v, i d =11 a, t j =25 c - 0.25 0.29 ? v gs =10 v, i d =11 a, t j =150 c - 0.67 - gate resistance r g f =1 mhz, open drain - 0.85 - ? value t c =25 c 17 values thermal resistance, junction - ambient rev. 2. 5 page 2 20 11 -0 9 -2 7
SPB17N80C3 parameter symbol conditions unit min. typ. max. dynamic characteristics input capacitance c iss - 2300 - pf output capacitance c oss -94- effective output capacitance, energy related 6) c o(er) -72- effective output capacitance, time related 7) c o(tr) - 210 - turn-on delay time t d(on) -25-ns rise time t r -15- turn-off delay time t d(off) -72- fall time t f -12- gate charge characteristics gate to source charge q gs -12-nc gate to drain charge q gd -45- gate charge total q g - 88 117 gate plateau voltage v plateau - 5.5 - v reverse diode diode forward voltage v sd v gs =0 v, i f =i s , t j =25 c - 1 1.2 v reverse recovery time t rr - 550 - ns reverse recovery charge q rr -15-c peak reverse recovery current i rrm -51-a 1) j-std20 and jesd22 2) pulse width t p limited by t j,max 6) c o(er) is a fixed capacitance that gives the same stored energy as c oss while v ds is rising from 0 to 80% v dss. 7) c o(tr) is a fixed capacitance that gives the same charging time as c oss while v ds is rising from 0 to 80% v dss. 5) device on 40mm*40mm*1.5 epoxy pcb fr4 with 6cm2 (one layer, 70m thick) copper area for drain connection. pcb is vertical without blown ai r v r =400 v, i f = i s , d i f /d t =100 a/s 3) repetitive avalanche causes additional power losses that can be calculated as p av = e ar * f. 4) i sd i d , di/dt 200a/s, v dclink = 400v, v peak |